CHARACTERIZATION

Optical measurement devices:

• UV-vis-NIR Varian Cary 500 Spectrophotometer
• UVISEL-VASE Horiba Jobin-Yvon Ellipsometer

Raman spectroscopy:

• Horiba Jobin-Yvon LabRAM HR800 UV-vis μ-Raman

Electron microscopes:

• LEO 912 OMEGA EFTEM
• Zeiss ULTRA plus FESEM
• Zeiss Sigma FESEM
• Jeol JXA-8200 EPMA
• FEI Helios DualBeam FIB+FESEM+STEM+EDS

X-RAY devices:

• Siemens D5000 XRD
• Bruker AXS S4 Pioneer XRF

Surface analysis:

• Thermo Fisher Scientific ESCALAB 250Xi XPS System

Other:

• Nikon Eclipse ME600 Microscope
• Zeiss LM 100 Microscope
• Veeco Dektak 8 Surface Profiler

LASERS

• Siemens Microbeam 3200
• New Wave Ezlaze 3
• New Wave QuickLaze Trilite
• Spectra-Physics Model 171 Ar+ Laser

PHOTOLITHOGRAPHY

• Suss RC8 Spinner
• Primus STT 15 Spinner
• Suss MA8 Mask Aligner
• Terra Universal Wet Bench
• Semitool PSC-101 Spin Rinse Dryer

FABRICATION OF PHOTOLITHOGRAPHY MASKS

• Micronic LRS-55 Photomask Patterning Device
• MIVA 2832 Photoplotter

THIN FILM FABRICATION

• Torr International Physical Vapor Deposition (PVD) System
• Oxford Instruments Plasmalab 80 Plus PECVD and ICP-DRIE

PACKAGING METHODS

• Kulicke & Soffa 4523 Wire and Ribbon Bonder
• Kulicke & Soffa 984-6 Dicing Saw
• Nisene JetEtch II Decapsulator
• LPS-2000 Integrated Circuit Repair System
• Finetech Electronics FINEPLACER Pico 145 Ball Bonding Device

TESTING OF MICROELECTRONIC CIRCUITS

• Tokyo Electron P-8XL Wafer Probe System
• Cascade Microtech REL-6100 Probe Station

FOCUSED ION BEAM (FIB)

• FEI Helios DualBeam FIB+FESEM+STEM+EDS

ETCHING

• Oxford Instruments ICP-DRIE Plasma Etching System
• Modutek Wet Bench

OTHER

• AMI MPS-9155 Screen Printer
• AG Associates Heatpulse 610 RTA Furnace
• FED 1500XL Dispencer
• Plas Labs Nanobox 890 Glove Box
• AIXTRON Nanoinstruments BM II Carbon Nanotube Reactor