Competence with Advanced System-on-Package Concept
European Structural and Investment Funds - INTERREG
620 000 EUR
Other university or unit
The goal of the project is to develop an advanced electronic packaging methodology based on Sequential Build Up (SBU) of Printed Circuit Board (PCB) using metallization process based on grafting with the managed reliability.
Design and development of interconnects using SBU technology based on Covalent Bonding Metallization (CBM)
Reliability analysis of developed structures
Standardization of the process for commercial use