Competence with Advanced System-on-Package Concept


Project description

The goal of the project is to develop an advanced electronic packaging methodology based on Sequential Build Up (SBU) of Printed Circuit Board (PCB) using metallization process based on grafting with the managed reliability.

Design and development of interconnects using SBU technology based on Covalent Bonding Metallization (CBM)
Reliability analysis of developed structures
Standardization of the process for commercial use

Project coordinator

Other university or unit


  • Microelectronics Research Unit, University of Oulu
  • Luleå Tekniska Universitet
  • Detection Technology
  • Electrotech
  • Optronic

Research groups

  • Microelectronics Research Unit