Competence with Advanced System-on-Package Concept
COMPACT
The goal of the project is to develop an advanced electronic packaging methodology based on Sequential Build Up (SBU) of Printed Circuit Board (PCB) using metallization process based on grafting with the managed reliability.
Projektin tiedot
Projektin kesto
-
Rahoittaja
Euroopan rakenne- ja investointirahastot - INTERREG
Projektin rahoittaja
Lapin liitto
Rahoituksen määrä
620 000 EUR
Projektin koordinaattori
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Yhteystiedot
Yhteyshenkilö
Projektin kuvaus
Goal:
The goal of the project is to develop an advanced electronic packaging methodology based on Sequential Build Up (SBU) of Printed Circuit Board (PCB) using metallization process based on grafting with the managed reliability.
Implementation:
Design and development of interconnects using SBU technology based on Covalent Bonding Metallization (CBM)
Reliability analysis of developed structures
Standardization of the process for commercial use