Competence with Advanced System-on-Package Concept

COMPACT

The goal of the project is to develop an advanced electronic packaging methodology based on Sequential Build Up (SBU) of Printed Circuit Board (PCB) using metallization process based on grafting with the managed reliability.

Rahoittajat

Projektin tiedot

Projektin kesto

-

Rahoittaja

Euroopan rakenne- ja investointirahastot - INTERREG

Projektin rahoittaja

Lapin liitto

Rahoituksen määrä

620 000 EUR

Projektin koordinaattori

Muu yliopisto tai yksikkö

Yhteystiedot

Yhteyshenkilö

Projektin kuvaus

Goal: 
The goal of the project is to develop an advanced electronic packaging methodology based on Sequential Build Up (SBU) of Printed Circuit Board (PCB) using metallization process based on grafting with the managed reliability.

Implementation: 
Design and development of interconnects using SBU technology based on Covalent Bonding Metallization (CBM)
Reliability analysis of developed structures
Standardization of the process for commercial use

Partners

  • Microelectronics Research Unit, University of Oulu
  • Luleå Tekniska Universitet
  • Detection Technology
  • Electrotech
  • Optronic

Research groups

  • Microelectronics Research Unit